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Thermal Grizzly Minus Pad Pro - 120x20x2.0 mm 2 pc - Thermal pad

Thermal pad delivering excellent thermal conductivity and outstanding compressibility while remaining electrically non-conductive and easy to apply. The Minus Pad Pro is part of the Minus Pad series, developed from the proven Minus Pad 8 to boost thermal performance and compressibility for components such as SSDs, GPU coolers, GPU water-cooling setups, voltage regulators and memory modules. Excellent thermal conductivity for efficient heat transfer Outstanding compressibility for tight-gap filling Electrically non-conductive for safe use on electronics Easy to use and install Color: gray Provides a reliable thermal interface between electronic components and cooling solutions to enhance heat dissipation in compact assemblies.

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Prijzen Thermal Grizzly Minus Pad Pro - 120x20x2.0 mm 2 pc - Thermal pad

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Thermal Grizzly Minus Pad Pro - 120x20x2.0 mm 2 pc - Thermal pad Informatique.nl 29,00 € 4,50 € 33,50 Op voorraad Nieuw Bespaar nuBestel nu
Informatique NL 29,00 € 4,50 € 33,50 Op voorraad Nieuw Bespaar nuBestel nu
Thermal Grizzly Minus Pad Pro - 120x20x2.0 mm 2 pc - Thermal pad Megekko 29,90 € 5,95 € 35,85 Op voorraad Nieuw Bespaar nuBestel nu
Thermal Grizzly Minus Pad Pro - 120x20x2.0 mm 2 pc - Thermal pad Amazon.nl Marketplace 29,90 Gratis € 29,90 Op voorraad Nieuw Bespaar nuBestel nu
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Thermal Grizzly Minus Pad Pro - 120x20x2.0 mm 2 pc - Thermal pad
Thermal pad delivering excellent thermal conductivity and outstanding compressibility while remaining electrically non-conductive and easy to apply. The Minus Pad Pro is part of the Minus Pad series, developed from the proven Minus Pad 8 to boost thermal performance and compressibility for components such as SSDs, GPU coolers, GPU water-cooling setups, voltage regulators and memory modules. Excellent thermal conductivity for efficient heat transfer Outstanding compressibility for tight-gap filling Electrically non-conductive for safe use on electronics Easy to use and install Color: gray Provides a reliable thermal interface between electronic components and cooling solutions to enhance heat dissipation in compact assemblies.

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