Thermal Grizzly Minus Pad Pro - 120x20x2.0 mm 2 pc - Thermal pad
Thermal pad delivering excellent thermal conductivity and outstanding compressibility while remaining electrically non-conductive and easy to apply. The Minus Pad Pro is part of the Minus Pad series, developed from the proven Minus Pad 8 to boost thermal performance and compressibility for components such as SSDs, GPU coolers, GPU water-cooling setups, voltage regulators and memory modules. Excellent thermal conductivity for efficient heat transfer Outstanding compressibility for tight-gap filling Electrically non-conductive for safe use on electronics Easy to use and install Color: gray Provides a reliable thermal interface between electronic components and cooling solutions to enhance heat dissipation in compact assemblies.
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Prijzen Thermal Grizzly Minus Pad Pro - 120x20x2.0 mm 2 pc - Thermal pad
| Winkel | Prijs | Verzendkosten | Totaal | Verzenddagen | Beschikbaar | Conditie | ||
|---|---|---|---|---|---|---|---|---|
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Informatique.nl | 29,00 | € 4,50 | € 33,50 | Op voorraad | Nieuw | Bespaar nuBestel nu | |
| Informatique NL | 29,00 | € 4,50 | € 33,50 | Op voorraad | Nieuw | Bespaar nuBestel nu | ||
| Megekko | 29,90 | € 5,95 | € 35,85 | Op voorraad | Nieuw | Bespaar nuBestel nu | ||
| Amazon.nl Marketplace | 29,90 | Gratis | € 29,90 | Op voorraad | Nieuw | Bespaar nuBestel nu |
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Thermal Grizzly Minus Pad Pro - 120x20x2.0 mm 2 pc - Thermal pad
Thermal pad delivering excellent thermal conductivity and outstanding compressibility while remaining electrically non-conductive and easy to apply. The Minus Pad Pro is part of the Minus Pad series, developed from the proven Minus Pad 8 to boost thermal performance and compressibility for components such as SSDs, GPU coolers, GPU water-cooling setups, voltage regulators and memory modules. Excellent thermal conductivity for efficient heat transfer Outstanding compressibility for tight-gap filling Electrically non-conductive for safe use on electronics Easy to use and install Color: gray Provides a reliable thermal interface between electronic components and cooling solutions to enhance heat dissipation in compact assemblies.
