Thermal Grizzly Minus Pad Pro - 120x20x0.5 mm 2 pc - Thermal pad
Thermal pads offer extremely high thermal conductivity, outstanding compressibility, electrical insulation, and straightforward installation for efficient component cooling. The Minus Pad Pro is the Pro-series thermal pad refined from the Minus Pad 8 to deliver improved thermal conductivity and compressibility for SSDs, GPU coolers, water blocks and electronic components. Excellent thermal conductivity Outstanding compressibility for tight contact Electrically non-conductive Easy to apply Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules Designed to enhance heat transfer between components and cooling solutions in compact assemblies.
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Amazon.nl Marketplace | 26,97 | Bekijk |
Prijzen Thermal Grizzly Minus Pad Pro - 120x20x0.5 mm 2 pc - Thermal pad
| Winkel | Prijs | Verzendkosten | Totaal | Verzenddagen | Beschikbaar | Conditie | ||
|---|---|---|---|---|---|---|---|---|
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Amazon.nl Marketplace | 26,97 | Gratis | € 26,97 | Op voorraad | Nieuw | Bespaar nuBestel nu | |
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Megekko | 28,95 | € 5,95 | € 34,90 | Op voorraad | Nieuw | Bespaar nuBestel nu | |
| Informatique NL | 29,00 | € 4,50 | € 33,50 | Op voorraad | Nieuw | Bespaar nuBestel nu | ||
| Proshop NL | 31,39 | € 6,99 | € 38,38 | Op voorraad | Nieuw | Bespaar nuBestel nu |
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Thermal Grizzly Minus Pad Pro - 120x20x0.5 mm 2 pc - Thermal pad
Thermal pads offer extremely high thermal conductivity, outstanding compressibility, electrical insulation, and straightforward installation for efficient component cooling. The Minus Pad Pro is the Pro-series thermal pad refined from the Minus Pad 8 to deliver improved thermal conductivity and compressibility for SSDs, GPU coolers, water blocks and electronic components. Excellent thermal conductivity Outstanding compressibility for tight contact Electrically non-conductive Easy to apply Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules Designed to enhance heat transfer between components and cooling solutions in compact assemblies.
